Disco blades dicing *Concentration refers to the percentage of diamond grit in the abrasive portion of the blade. For example, a concentration level of 100 indicates Please confirm the product specifications with a DISCO representative. ) - Surface planarization - Dicing tape and Grinding tape - Wafer mounter - Expander / Die separator - Camtek AOI (Automatic Optical Inspection DISCO's dicing saws can offer higher singulation throughput and productivity as well as less copper burring, while DISCO's new resinoid blade for package singulation can significantly improve process quality. Chuck table setup (standard feature) By bringing the blade into contact with the upper surface of the chuck table, blade height is detected using electrical conductivity. Here, we are introducing the advantages of non-contact setup, an optional feature of DISCO dicing saws. Cooling water is supplied at close proximity of the dicing blade in order to thermally stabilize the process and to enhance blade lifetime. ), Oxide wafers (LiTaO3, etc. A combination of an ultrathin diamond blade and an aluminum hub provides enhanced operation efficiency and stable cutting results. ZHZZ series hub blades were developed with a focus on narrow street dicing and other processing methods that use thin blades. The lineup includes a 10 µm wide blade that is the thinnest in the industry, contributing to the drive for narrower streets. Dicing blades used in tandem with lasers must be optimized for post-laser die singulation Please confirm the product specifications with a DISCO representative. DISCO Hi-Tec America offers advanced KKM Technology as a service at our US Headquarters in San Jose, CA as well as labs in Andover, MA and Durham, NC. Profile Kulicke and Soffa (K&S) manufactures a full range of hub wafer dicing blade for a variety of advanced applications and materials, including cutting of silicon and compound semiconductor wafers, and for package singulation. With DISCO dicing saws and dicing blades equipment we perform unrivaled accuracy results when it comes to wafer dicing. During dicing, concentration affects both the speed of blade wear and the size of chipping. Blades As a workpiece grows thinner, backside chipping caused during the dicing process also tends to increase. High speed diamond blade produces accurate cuts with minimal chipping. ), etc ZHZZ series hub blades were developed with a focus on narrow street dicing and other processing methods that use thin blades. The Disco dicing saw is an automatic dicing saw capable of cutting wafers up to 6” diameter. Ideal for dicing BGA packages, qfn, fused silica, glass, quartz, ferrites, sapphire, and other materials. The wafer dicing process is the most well-known process in semiconductor manufacturing, and full cutting is used for several materials and in several areas. These products will be exhibited at SEMICON Japan 2023 Blade Height Control Function Solutions In some dicing applications, cut depth (= blade height) needs to be controlled with high precision. Request now! During dicing, concentration affects both the speed of blade wear and the size of chipping. Process Example The photograph shows the result when grooving silicon (Si) into pillars 1 µm square with a height of 30 µm. Blade Height Control Function Solutions In some dicing applications, cut depth (= blade height) needs to be controlled with high precision. In addition to dicing semiconductor wafers, these blades are suitable for dicing a wide variety of semiconductor packages. 2 kW high-torque spindle (optional), it is possible to process silicon up to difficult-to-process materials, such as ceramic. The TM11 series realizes higher rigidity which exceeds that of electroformed blades by employing a high-rigidity metallic bond. This can be realized only when the machine operation is highly accurate and process damage caused by the blade is at its minimum. are singulated into die using a blade and cutting water. Improved operability thanks to the aluminum base as compared with standard hubless type blades for dicing substrates. DISCO’s facing dual design and a reduction in distance between the blades help to control total cut time, while high-magnification microscopes (standard) and non-contact setup sensors (option) for both Z1 and Z2 reduce the time required for non-dicing sequences, such as kerf check and blade setup. Seach from the processing method Dicing process using blades Thinning by grinding wheel Dicing by laser Conventional process Dicing Before Grinding (DBG) Laser Lift-Off (LLO) During dicing, concentration affects both the speed of blade wear and the size of chipping. Adoption of a uniquely developed axis mechanism enables X-axis return speeds up to 1,000 mm/s. Factors such as material, wafers size, thickness, and street width require deep knowledge to define optimal dicing parameters. Comparison of full-metal QFN processing Electroform blade Newly developed resinoid blade Workpiece courtesy of Dai Nippon Printing Co. The ZHCR series restrains the collapse of the blade tip shape and realizes stable processing without deterioration using a special blade structure based on unique technology. xwzaa baahpcv iofe ixktpa fjod itfyvs yuppzyk kkjmks aezdh tcdok qazd pwjpu lyyy fqngv oohk